ADHESIVE TAPE - SUMITOMO BAKELITE CO

Title:

ADHESIVE TAPE

Document Type and Number:

WIPO Patent Application WO/2008/044330

Kind Code:

A1

Abstract:

Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy resin, and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorus compound. This adhesive tape can be used as an interlayer material for circuit boards or multilayer flexible printed wiring boards.

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Inventors:

KOMIYATANI TOSHIO (JP)
HIRANO TAKASHI (JP)
MAEJIMA KENZOU (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)

Application Number:

PCT/JP2007/001058

Publication Date:

April 17, 2008

Filing Date:

September 28, 2007

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
KOMIYATANI TOSHIO (JP)
HIRANO TAKASHI (JP)
MAEJIMA KENZOU (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)

International Classes:

C09J7/10; C09J163/00; C09J201/06; C09J133/20; C09J171/08; H05K3/46

Foreign References:

JP2004291054A	2004-10-21
JP2003128874A	2003-05-08
JP2001288445A	2001-10-16
JP2005501725A	2005-01-20
JP2002033580A	2002-01-31
JP2005194306A	2005-07-21
JPH1154934A	1999-02-26

Other References: