Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2019/087277
Kind Code:
A1
Abstract:
The present invention discloses an adhesive tape that has an adhesive layer containing a conductive filler on both surfaces of a conductive base material, wherein the ratio (B/A) of the total thickness (B) of the adhesive layers and the thickness (A) of the conductive base material is less than 2, and the content of the conductive filler is greater than or equal to 45 parts by mass with respect to 100 parts by mass of a resin component of the adhesive layer. This adhesive tape possesses flame retardancy that passes UL94 HB (horizontal burning test) even in a case in which the adhesive layer does not contain a flame retardant, and the adhesive tape also has excellent thermal conductivity and adhesiveness.
Inventors:
YAMAGATA TOSHIHIRO (JP)
Application Number:
PCT/JP2017/039259
Publication Date:
May 09, 2019
Filing Date:
October 31, 2017
Export Citation:
Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
C09J9/02; C09J11/04
Foreign References:
| JP2013245234A | 2013-12-09 | |||
| JP2014234444A | 2014-12-15 | |||
| JP2009079127A | 2009-04-16 |
Attorney, Agent or Firm:
ISHIBASHI, Masayuki et al. (JP)
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