Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2020/085157
Kind Code:
A1
Abstract:
Provided is an adhesive tape that: is capable of preventing an adherend (e.g., an LED chip) from being buried; and has sufficient adherend holding power. This adhesive tape comprises a base material and an adhesive layer arranged on at least one surface of the base material. The change in the displacement of indentation depth is no more than 3.5 µm when the surface of the adhesive layer is pressurized for 10 minutes at a load of 0.04 MPa by a terminal having a contact area of 12.5 mm2, at an ambient temperature of 50°C. The adhesive force for a SUS board at 23°C is at least 5 N/40 mm.
Inventors:
YUTOU TAKUMI (JP)
Application Number:
PCT/JP2019/040594
Publication Date:
April 30, 2020
Filing Date:
October 16, 2019
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; B32B27/00; B32B27/30; C09J11/06; C09J133/08; C09J133/10; C09J201/00
Foreign References:
| JP2017066295A | 2017-04-06 | |||
| JP2004214069A | 2004-07-29 | |||
| JP2014113705A | 2014-06-26 | |||
| JP2017152372A | 2017-08-31 | |||
| JP2015021116A | 2015-02-02 | |||
| JP2018035339A | 2018-03-08 | |||
| JP2011174042A | 2011-09-08 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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