Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/281996
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesive tape for wafer processing that combines tensile stress and uniform expandability suitable for a step of dividing an adhesive layer by expansion, and high shrinkability that can eliminate slack of the tape that occurs during expansion in a heat shrinking step. The solution to the problem is an adhesive tape for wafer processing comprising an adhesive layer and a base film of at least two layers having a first resin layer and a second resin layer that have an ionomer resin content of at least 80 mass%, the ionomer resin comprising a resin in which the Vicat softening temperature is 50 to 79°C and some of the acid groups of an ethylene-unsaturated carboxylic acid copolymer have been neutralized by zinc ions, the ratio of structural units derived from unsaturated carboxylic acids contained in the ethylene-unsaturated carboxylic acid copolymer being 6.9-18.0 mass% assuming 100 mass% to be all of the structural units of the ethylene-unsaturated carboxylic acid copolymer, and the zinc ion concentration being 0.38–0.60 mmol per gram of ethylene-unsaturated carboxylic acid copolymer.
Inventors:
MASUDA AKIYOSHI (JP)
SATO HIROKAZU (JP)
SATO HIROKAZU (JP)
Application Number:
PCT/JP2022/023933
Publication Date:
January 12, 2023
Filing Date:
June 15, 2022
Export Citation:
Assignee:
MAXELL LTD (JP)
International Classes:
H01L21/301; B32B27/00; B32B27/32; C09J7/24; C09J7/38; C09J11/04; C09J11/06; C09J133/14; C09J161/04; C09J163/00; C09J201/00
Domestic Patent References:
| WO2016152919A1 | 2016-09-29 |
Foreign References:
| JP2017063210A | 2017-03-30 | |||
| JP2011216508A | 2011-10-27 | |||
| JP2012214526A | 2012-11-08 | |||
| JP2018016705A | 2018-02-01 | |||
| JP2020194904A | 2020-12-03 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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