Title:
ADHESIVE AND THERMAL MATERIAL STUCK IN USE PRODUCED THEREWITH
Document Type and Number:
WIPO Patent Application WO/2005/030897
Kind Code:
A1
Abstract:
A hot melt type adhesive having properties required for sticking a thermal material to the skin with a good balance, especially a highly safe adhesive having an adhesive strength sufficient to stick a thermal material to the skin and exhibiting high capability of skin protection; and a thermal material produced with the adhesive. In particular, there is provided a hot melt type adhesive for sticking a thermal material, comprising a base polymer, a tackifier, a softening agent and a surfactant as indispensable constituents, characterized in that the surfactant is contained in an amount of 5 to 25 parts by weight per 100 parts by weight of the sum of all the components other than the surfactant. Further, there is provided a thermal material stuck in use including a heating element having an adhesive layer comprised of this adhesive.
Inventors:
ARAI NORICHIKA (JP)
MIYASHITA EIJI (JP)
OHARA NAOKI (JP)
TOUHARA NAOKO (JP)
WADA YOSHIO (JP)
MIYASHITA EIJI (JP)
OHARA NAOKI (JP)
TOUHARA NAOKO (JP)
WADA YOSHIO (JP)
Application Number:
PCT/JP2004/013805
Publication Date:
April 07, 2005
Filing Date:
September 22, 2004
Export Citation:
Assignee:
FERRIC INC (JP)
ARAI NORICHIKA (JP)
MIYASHITA EIJI (JP)
OHARA NAOKI (JP)
TOUHARA NAOKO (JP)
WADA YOSHIO (JP)
ARAI NORICHIKA (JP)
MIYASHITA EIJI (JP)
OHARA NAOKI (JP)
TOUHARA NAOKO (JP)
WADA YOSHIO (JP)
International Classes:
A61F13/02; A61F7/08; A61L15/58; C09J11/06; C09J153/02; (IPC1-7): C09J201/00; C09J11/06; C09J153/02; A61F7/08
Foreign References:
JP2004115774A | 2004-04-15 | |||
JP2003081817A | 2003-03-19 | |||
JP2001514051A | 2001-09-11 | |||
JP2002512295A | 2002-04-23 | |||
JP2001515091A | 2001-09-18 | |||
JPH01297059A | 1989-11-30 | |||
JPH1119112A | 1999-01-26 |
Other References:
See also references of EP 1666557A4
Attorney, Agent or Firm:
Mae, Naomi (3th Floor Kudan-Tsuda Bldg., 7-12, Kudanminami 3-chom, Chiyoda-ku Tokyo 74, JP)
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