ADSORPTIVE MEMBER AND DEVICE USING SAME

Title:

ADSORPTIVE MEMBER AND DEVICE USING SAME

Document Type and Number:

WIPO Patent Application WO/2011/132527

Kind Code:

A1

Abstract:

Disclosed is an adsorptive member that is used in the heat exchanger of an adsorption heat pump, or the like, and in the humidity control device of a desiccant system, or the like, and has excellent heat resistance and adhesion between adsorptive particles and substrates. The adsorptive member has an adsorbent layer disposed upon a substrate, wherein said adsorbent layer is a cured epoxy product in which adsorptive particles and a binder are essential components, and said binder has the following (a) and (b) structural units: (a) a bisphenol structural unit; (b) a linear hydrocarbon structural unit having 4 or more carbon atoms, and/or a polyalkylene ether structural unit having 3 or more ether oxygen atoms.

Inventors:

TABATA DAIKI (JP)
OKAMOTO KUMIKO (JP)
TANIGUCHI KOUICHIROU (JP)
KUBOKAWA SEIICHI (JP)

Application Number:

PCT/JP2011/058600

Publication Date:

October 27, 2011

Filing Date:

April 05, 2011

Export Citation:

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Assignee:

MITSUBISHI PLASTICS INC (JP)
TABATA DAIKI (JP)
OKAMOTO KUMIKO (JP)
TANIGUCHI KOUICHIROU (JP)
KUBOKAWA SEIICHI (JP)

International Classes:

B01D53/26; B01D53/02; B01J20/10; B01J20/18

Foreign References:

JP2007190546A	2007-08-02
JP2004136269A	2004-05-13
JPH07301469A	1995-11-14
JPS57122950A	1982-07-31
JPH11248389A	1999-09-14
JP2004313897A	2004-11-11
JP2004330095A	2004-11-25
JPH10286460A	1998-10-27
JP2007190546A	2007-08-02
JP2009106799A	2009-05-21
JP2004268020A	2004-09-30
JPH0157041B2	1989-12-04
JP2003183020A	2003-07-03
JP2004136269A	2004-05-13
JP2002003576A	2002-01-09

Other References: