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Title:
AF MODULE, CAMERA MODULE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/139255
Kind Code:
A1
Abstract:
There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

Inventors:
FUKUYAMA MUNEKATSU (JP)
MATSUGAI HIROYASU (JP)
ITOU HIROYUKI (JP)
SAITO SUGURU (JP)
OHSHIMA KEIJI (JP)
IWASAKI MASANORI (JP)
HAYASHI TOSHIHIKO (JP)
SATO SHUZO (JP)
FUJII NOBUTOSHI (JP)
TAZAWA HIROSHI (JP)
SHIRAIWA TOSHIAKI (JP)
MORIYA YUSUKE (JP)
ISHIDA MINORU (JP)
Application Number:
PCT/JP2018/000936
Publication Date:
August 02, 2018
Filing Date:
January 16, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B7/04; G02B3/00; G02B13/00
Domestic Patent References:
WO2011058876A12011-05-19
Foreign References:
US20120002102A12012-01-05
US20090015706A12009-01-15
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JP2009279790A2009-12-03
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JP2010256563A2010-11-11
JP2013001091A2013-01-07
JP2010204631A2010-09-16
JP2015102794A2015-06-04
JP2008286527A2008-11-27
JP2006318060A2006-11-24
JP2012015642A2012-01-19
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JP2002243918A2002-08-28
US20120170920A12012-07-05
JP2011530715A2011-12-22
US20140036183A12014-02-06
JP2013200366A2013-10-03
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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