Title:
Ag ALLOY SPUTTERING TARGET, AND Ag ALLOY FILM
Document Type and Number:
WIPO Patent Application WO/2020/162221
Kind Code:
A1
Abstract:
The present invention is characterised by comprising Mg in the range of more than 1.0 atomic%-5.0 atomic% or less, and Pd in the range of more than 0.10 atomic%-2.00 atomic% or less, the remainder being Ag and unavoidable impurities. Also, at least 0.10 atomic% of Au may be included, and the total amount of Au and Pd included may be 5.00 atomic% or less. Ca may also be included in the range of 0.01-0.15 atomic%, inclusive. Also, the amount of oxygen included may be 0.010 mass% or less.
Inventors:
TOSHIMORI YUTO (JP)
NONAKA SOHEI (JP)
NONAKA SOHEI (JP)
Application Number:
PCT/JP2020/002462
Publication Date:
August 13, 2020
Filing Date:
January 24, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34; C22C5/06; C22F1/00; C22F1/14; C23C14/06; H01L21/285
Domestic Patent References:
| WO2014088098A1 | 2014-06-12 |
Foreign References:
| JP2019020064A | 2019-02-07 | |||
| JP2006028641A | 2006-02-02 | |||
| JPH09291356A | 1997-11-11 | |||
| JPH10239697A | 1998-09-11 | |||
| JP2016040411A | 2016-03-24 |
Other References:
See also references of EP 3922748A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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