Title:
Ag ALLOY SPUTTERING TARGET AND Ag ALLOY FILM
Document Type and Number:
WIPO Patent Application WO/2021/090581
Kind Code:
A1
Abstract:
This Ag alloy sputtering target and this Ag alloy film each comprise Au in the range of 0.10-5.00 atom% and Ca in the range of 0.01-0.20 atom%, with the remainder comprising Ag and unavoidable impurities.
Inventors:
TOSHIMORI YUTO (JP)
NONAKA SOHEI (JP)
NONAKA SOHEI (JP)
Application Number:
PCT/JP2020/034882
Publication Date:
May 14, 2021
Filing Date:
September 15, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34; C22C5/06; C23C14/14; G06F3/041
Domestic Patent References:
| WO2015156093A1 | 2015-10-15 |
Foreign References:
| JP2002319185A | 2002-10-31 | |||
| JP2003006926A | 2003-01-10 | |||
| JP2002129260A | 2002-05-09 | |||
| JP2013204052A | 2013-10-07 | |||
| JP2004131747A | 2004-04-30 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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