AGENT FOR REMOVING CONDUCTIVE FILM AND METHOD FOR REMOVING CONDUCTIVE FILM

Title:

AGENT FOR REMOVING CONDUCTIVE FILM AND METHOD FOR REMOVING CONDUCTIVE FILM

Document Type and Number:

WIPO Patent Application WO/2010/113744

Kind Code:

A1

Abstract:

Disclosed is an agent for removing a conductive film, which contains: an acid having a boiling point of not less than 80˚C, a base having a boiling point of not less than 80˚C, or a compound that generates an acid or a base by the action of an external energy; a solvent; a resin; and a leveling agent. Also disclosed is a method for removing a conductive film, which uses the agent for removing a conductive film. The agent for removing a conductive film and the method for removing a conductive film are capable of in-plane uniformly removing a desired portion of a conductive film.

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Inventors:

SEKIGUCHI, Hiroki (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)
関口広樹 (〒58 滋賀県大津市園山１丁目１番１号　東レ株式会社　滋賀事業場内 Shiga, 〒5208558, JP)

Application Number:

JP2010/055178

Publication Date:

October 07, 2010

Filing Date:

March 25, 2010

Export Citation:

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Assignee:

TORAY INDUSTRIES, INC. (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 66, 〒1038666, JP)
東レ株式会社 (〒66 東京都中央区日本橋室町２丁目１番１号 Tokyo, 〒1038666, JP)
SEKIGUCHI, Hiroki (Toray Industries Inc., 1-1, Sonoyama 1-chome, Otsu-sh, Shiga 58, 〒5208558, JP)

International Classes:

C09K13/04; C09K13/02; C09K13/06; H01B13/00; H01J11/02; H01L21/306; H05K3/06

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