Title:
AGGREGATE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/067238
Kind Code:
A1
Abstract:
An aggregate substrate (101) is provided with: a plurality of element parts (PP11) and the like each having an electric function; and connection parts (CP) which are respectively connected to the plurality of element parts (PP11) and the like and which have no electric functions, wherein the element parts and the connection parts are arrayed in order. The element parts (PP11) and the like include: body parts (BP); first small-numbered laminate parts (LP1) in which the number of laminates of insulating resin substrates is less than in the body parts (BP); and second small-numbered laminate parts (LP2) in which the number of laminates of the insulating resin substrates is even less than in the first small-numbered laminate parts (LP1). The first low-numbered laminate parts (LP1) are each connected to the corresponding body part (BP), and the second low-numbered laminate parts (LP2) are each connected in between the corresponding first small-numbered laminate part (LP1) and the corresponding connection part (CP). The number of laminates of the insulating resin substrates in the connection parts (CP) is the same as the number of laminates of the insulating resin substrates in the second low-numbered laminate parts (LP2).
Inventors:
OKUDA NORIAKI (JP)
FUJIMURA YU (JP)
FURUMURA TOMOHIRO (JP)
OSUGA TAKESHI (JP)
OGURI SHINYA (JP)
EDAGAWA YUSUKE (JP)
FUJIMURA YU (JP)
FURUMURA TOMOHIRO (JP)
OSUGA TAKESHI (JP)
OGURI SHINYA (JP)
EDAGAWA YUSUKE (JP)
Application Number:
PCT/JP2019/037756
Publication Date:
April 02, 2020
Filing Date:
September 26, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/00; H01F17/00; H01F41/04; H01Q1/38; H05K1/02; H05K1/16
Domestic Patent References:
| WO2012057286A1 | 2012-05-03 | |||
| WO2012147484A1 | 2012-11-01 |
Foreign References:
| JP2007110027A | 2007-04-26 | |||
| JP2005142452A | 2005-06-02 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF: