Title:
AGGREGATED BORON NITRIDE PARTICLES, BORON NITRIDE POWDER, HEAT-CONDUCTIVE RESIN COMPOSITION, AND HEAT-DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2022/149553
Kind Code:
A1
Abstract:
These aggregated boron nitride particles are formed by aggregating hexagonal boron nitride primary particles and contain an alkyl group-containing silane coupling agent. The present invention can provide: boron nitride powder for obtaining a heat-dissipation sheet having excellent heat conductivity; a heat-dissipation sheet having excellent heat conductivity; and a method for manufacturing a heat-dissipation sheet having excellent heat conductivity.
Inventors:
WADA KOSUKE (JP)
FUJI KIYOTAKA (JP)
FUJI KIYOTAKA (JP)
Application Number:
PCT/JP2021/048887
Publication Date:
July 14, 2022
Filing Date:
December 28, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01B21/064; C08K3/38; C08K5/5419; C08L83/07; C08L101/00; C09K5/14
Domestic Patent References:
| WO2016092951A1 | 2016-06-16 |
Foreign References:
| JP2016108457A | 2016-06-20 | |||
| JP2020164365A | 2020-10-08 | |||
| JP2016027144A | 2016-02-18 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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