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Patent Searching and Data


Title:
AIR FILM FOR CHEMICAL MECHANICAL POLISHING HEAD, CHEMICAL MECHANICAL POLISHING HEAD, AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/253869
Kind Code:
A1
Abstract:
The present application provides an air film for a chemical mechanical polishing head, the chemical mechanical polishing head, and a polishing device. The air film is configured to comprises: a bottom plate for receiving a substrate; an annular side wall, the side wall having an upright portion extending upwards along the periphery of the bottom plate, a bent portion formed by extending upwards from the upper end of the upright portion and bending inwards and then extending upwards and bending outwards, and a first horizontal extension portion formed by bending inwards from the upper end of the bent portion and extending horizontally; and an inner side wall arranged concentrically adjacent to the side wall, the inner side wall having at the top end a second horizontal extension portion bent inwards and extending horizontally; wherein the bent portion extends outwards without exceeding the circumferential outer surface of the upright portion.

Inventors:
ZHAO, Dewen (CN)
Application Number:
CN2020/097424
Publication Date:
December 24, 2020
Filing Date:
June 22, 2020
Export Citation:
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Assignee:
TSINGHUA UNIVERSITY (CN)
International Classes:
B24B37/04; B24B37/00
Attorney, Agent or Firm:
ACIP LAW OFFICES (CN)
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