Title:
AIR-FLOW-BY COOLING TECHNOLOGY AND AIR-FLOW-BY CIRCUIT BOARD MODULES
Document Type and Number:
WIPO Patent Application WO/2014/089076
Kind Code:
A3
Abstract:
Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.
Inventors:
MCKENNEY DARRYL J (US)
ZUIDEMA PAUL (US)
BLANCHET DONALD (US)
COOLIDGE DANIEL (US)
ZUIDEMA PAUL (US)
BLANCHET DONALD (US)
COOLIDGE DANIEL (US)
Application Number:
PCT/US2013/072869
Publication Date:
October 30, 2014
Filing Date:
December 03, 2013
Export Citation:
Assignee:
MERCURY COMP SYSTEMS INC (US)
International Classes:
G06F1/20; H05K7/20; H05K7/14
Foreign References:
| US4771365A | 1988-09-13 | |||
| US20020061102A1 | 2002-05-23 | |||
| EP1938677A2 | 2008-07-02 |
Attorney, Agent or Firm:
CANNING, Kevin, J. et al. (One Post Office SquareBoston, MA --2127, US)
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