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Patent Searching and Data


Title:
AIRFLOW SENSOR CIRCUIT BOARD MACHINING PROCESS, PRODUCT, AIRFLOW SENSOR, AND ELECTRONIC PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/016346
Kind Code:
A1
Abstract:
The present invention relates to an airflow sensor circuit board machining process, a product, an airflow sensor, and an electronic product. The airflow sensor circuit board machining process comprises the following steps: machining micropores in an airflow sensor circuit board; and machining a hydrophobic and oleophobic layer on the inner walls of the micropores and around openings of the micropores, wherein the hydrophobic and oleophobic layer on the inner walls of the micropores does not block the micropores. By applying the method of the present application, existing macropores are changed into micropores, a hydrophobic and oleophobic layer is machined on the inner walls of the micropores and around openings, and the hydrophobic and oleophobic layer on the inner walls of the micropores cannot block the micropores to guarantee ventilation, such that when liquid such as water and oil approaches the micropores, due to the liquid convergence characteristic of the hydrophobic and oleophobic layer, the size of water/oil drops is increased and thus greater than the size of the micropores, thereby achieving a water-proof/oil-proof effect.

Inventors:
CHENG XIAOZHONG (CN)
Application Number:
PCT/CN2022/107487
Publication Date:
January 25, 2024
Filing Date:
July 22, 2022
Export Citation:
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Assignee:
SHENZHEN CHIPTECH ELECTRONICS CO LTD (CN)
International Classes:
H04R31/00
Foreign References:
CN210351643U2020-04-17
CN106304709A2017-01-04
CN206100450U2017-04-12
CN211020983U2020-07-17
US20070153488A12007-07-05
Attorney, Agent or Firm:
SHENZHEN DUOZHIHUI NEW INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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