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Patent Searching and Data


Title:
AIRTIGHT PACKAGE MANUFACTURING METHOD AND AIRTIGHT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/199491
Kind Code:
A1
Abstract:
Provided is an airtight package manufacturing method by which a glass lid can be bonded to a container in a closely fitting manner by laser irradiation, without pressing the glass lid using a pressing member. The method is characterized by being provided with: a step of arranging a sealing material 4A between a side wall portion 3b of a container 3 and a glass lid 5A and placing the glass lid 5A on the side wall portion 3b; a step of causing the glass lid 5A to be closely fitted to the sealing material 4A on the side wall portion 3b by suctioning the glass lid 5A in the direction of a recess portion 3; and a step of melting the sealing material 4A by irradiation of laser light L with the glass lid 5A closely fitted to the sealing material 4A, in order to bond the side wall portion 3b and the glass lid 5A to each other.

Inventors:
OKA TAKUJI (JP)
ARAKAWA HIROSHI (JP)
SHIRAGAMI TORU (JP)
Application Number:
PCT/JP2017/005255
Publication Date:
November 23, 2017
Filing Date:
February 14, 2017
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
H01L23/02; B23K26/57; C03C27/06; H01L23/20; H01L33/52
Foreign References:
JP2006278865A2006-10-12
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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