Title:
AIRTIGHT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/147210
Kind Code:
A1
Abstract:
An airtight package according to the present invention is an airtight package in which a package substrate and a glass lid are hermetically sealed/bonded with a sealing/bonding material layer interposed therebetween and is characterized in that: the package substrate has a base section and a frame section provided on the base section; an internal element is accommodated in the frame section of the package substrate; the sealing/bonding material layer is provided between a top portion of the frame section of the package substrate and the glass lid; and an end portion of the sealing/bonding material layer protrudes laterally in an arc shape in cross-sectional view.
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Inventors:
SHIRAGAMI TORU (JP)
FUJITA HIROKI (JP)
FUJITA HIROKI (JP)
Application Number:
PCT/JP2018/003753
Publication Date:
August 16, 2018
Filing Date:
February 05, 2018
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
H01L23/02; C03C8/24; H01L23/08; H01L23/10
Domestic Patent References:
| WO2016136899A1 | 2016-09-01 |
Foreign References:
| JP2016027610A | 2016-02-18 | |||
| JPH05226493A | 1993-09-03 |
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