Title:
AL WIRING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/065551
Kind Code:
A1
Abstract:
The present invention provides an Al wiring material that suppresses a decrease in yield during production while also achieving both heat shock resistance and suppression of chip cracking. The Al wiring material contains at least Sc and Zr, satisfies both 0.01≤x1≤0.5 and 0.01≤x2≤0.3, where x1 represents the Sc content (wt%) and x2 represents the Zr content (wt%), and contains Al as the remainder.
Inventors:
KURIHARA YUTO (JP)
OISHI RYO (JP)
ETO MOTOKI (JP)
ODA DAIZO (JP)
OYAMADA TETSUYA (JP)
SUTO YUYA (JP)
UNO TOMOHIRO (JP)
OISHI RYO (JP)
ETO MOTOKI (JP)
ODA DAIZO (JP)
OYAMADA TETSUYA (JP)
SUTO YUYA (JP)
UNO TOMOHIRO (JP)
Application Number:
PCT/JP2020/035337
Publication Date:
April 08, 2021
Filing Date:
September 17, 2020
Export Citation:
Assignee:
NIPPON MICROMETAL CORP (JP)
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
H01B1/02; H01B5/02; H01L21/60
Foreign References:
| JP2014047417A | 2014-03-17 | |||
| JP2001348637A | 2001-12-18 | |||
| JP2016511529A | 2016-04-14 | |||
| JP2004218090A | 2004-08-05 | |||
| JP2002314038A | 2002-10-25 | |||
| JP2016511529A | 2016-04-14 | |||
| JP2016152316A | 2016-08-22 | |||
| JP2014129578A | 2014-07-10 | |||
| JP2002246542A | 2002-08-30 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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