Title:
ALIGNMENT METHOD AND ALIGNMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/217543
Kind Code:
A1
Abstract:
An alignment method is provided with: a preparation step S1 for preparing an object 100 to be aligned in which a first substrate 110 and a second substrate 120 are stacked with an uncured resin material 130 therebetween; an alignment step S4 for detecting the relative positional relationship between the first substrate 110 and the second substrate 120 with the uncured resin material interposed between the first substrate 110 and the second substrate 120 and on the basis of the detection results, aligning the first substrate and the second substrate with each other; and after the alignment step is started, a curing step S5 for curing the uncured resin material. The alignment step comprises a first alignment step S41 in which the first substrate and/or the second substrate is moved in the planar direction.
Inventors:
YAMAGISHI HIROYUKI (JP)
KATSURA GO (JP)
NAKAGAWA KENJI (JP)
KATSURA GO (JP)
NAKAGAWA KENJI (JP)
Application Number:
PCT/JP2017/022373
Publication Date:
December 21, 2017
Filing Date:
June 16, 2017
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
B32B37/12; C03C27/12; H01L21/683
Domestic Patent References:
| WO2013011970A1 | 2013-01-24 |
Foreign References:
| JPH05160340A | 1993-06-25 | |||
| JP2016008985A | 2016-01-18 | |||
| JP2011216832A | 2011-10-27 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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