Title:
ALKALI-DEVELOPABLE THERMOSETTING RESIN COMPOSITION, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/172433
Kind Code:
A1
Abstract:
Provided are a printed wiring board and an alkali-developable thermosetting resin composition with which a pattern layer can be formed by developing, even when an inorganic filler is filled in to a high level. Furthermore, the aim of the present invention is to provide a printed wiring board and an alkali-developable thermosetting resin composition with which a pattern layer exhibiting superior cooling/heating cycle characteristics can be formed. The alkali-developable thermosetting resin composition is characterized by containing an alkali-developable resin, a heat-reactive compound, an inorganic filler and a photobase-generating agent, and by using selective optical irradiation to cause an addition reaction between the alkali-developable resin and the heat-reactive compound in order to enable negative pattern formation by alkali development.
Inventors:
ENDO ARATA (JP)
MINEGISHI SHOJI (JP)
ARIMA MASAO (JP)
MINEGISHI SHOJI (JP)
ARIMA MASAO (JP)
Application Number:
PCT/JP2013/063726
Publication Date:
November 21, 2013
Filing Date:
May 16, 2013
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G59/68; C08G59/40; C08L63/00; H05K3/28
Domestic Patent References:
| WO2006129697A1 | 2006-12-07 |
Foreign References:
| JP2008134621A | 2008-06-12 |
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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