Title:
ALKALI-FREE GLASS SUBSTRATE, LAMINATED SUBSTRATE, AND GLASS SUBSTRATE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/025727
Kind Code:
A1
Abstract:
Provided are a glass substrate and a glass substrate production method, wherein, in a heat treatment step for bonding together a silicon substrate and a glass substrate, the glass substrate causes less residual stress generated in the silicon substrate. The present invention relates to an alkali-free glass substrate which contains 0.1-10% ZnO in mole percentage in terms of oxides, wherein the average thermal expansion coefficient at 50-100°C, the average thermal expansion coefficient at 200-300°C, and a value obtained by dividing the average thermal expansion coefficient at 200-300°C by the average thermal expansion coefficient at 50-100°C, all fall within specific ranges.
Inventors:
NOMURA SHUHEI (JP)
ONO KAZUTAKA (JP)
ONO KAZUTAKA (JP)
Application Number:
PCT/JP2017/027112
Publication Date:
February 08, 2018
Filing Date:
July 26, 2017
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03C3/085; C03B17/06; C03B25/02; C03C3/087; C03C3/093
Domestic Patent References:
| WO2016194861A1 | 2016-12-08 |
Foreign References:
| JPH11292563A | 1999-10-26 | |||
| JP2001220172A | 2001-08-14 | |||
| JP2001220173A | 2001-08-14 | |||
| JP2002308643A | 2002-10-23 | |||
| JP2003335548A | 2003-11-25 | |||
| JP3153710B2 | 2001-04-09 | |||
| JP2006347796A | 2006-12-28 |
Other References:
G. K. WHITE ET AL.: "Thermophysical Properties of Some Key Solids: An Update", INTERNATIONAL JOURNAL OF THERMOPHYSICS, vol. 18, no. 5, 1 September 1997 (1997-09-01), pages 1269 - 1327, XP055460105
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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