Title:
ALKALI METAL-CONTAINING POLISHING SYSTEM AND METHOD
Document Type and Number:
WIPO Patent Application WO2002061008
Kind Code:
A3
Abstract:
The invention provides a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety contains at least one oxygen atom, and (d) a polishing pad and/or an abrasive, wherein the total ion concentration of the system is above the critical coagulation concentration. The invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a the aforementioned polishing system or a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety contains at least one oxygen atom, and (d) a polishing pad and/or an abrasive, and polishing at least a portion of the substrate therewith in about 6 hours or less after the polishing system is prepared.
Inventors:
CARTER PHILLIP
BOGUSH GREGORY H
DE REGE THESAURO FRANCESCO
SCHROEDER DAVID J
CHAMBERLAIN JEFFREY P
MUELLER BRIAN L
BOGUSH GREGORY H
DE REGE THESAURO FRANCESCO
SCHROEDER DAVID J
CHAMBERLAIN JEFFREY P
MUELLER BRIAN L
Application Number:
PCT/US2002/005005
Publication Date:
September 19, 2002
Filing Date:
January 14, 2002
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
C09G1/02; C09K3/14; H01L21/304; B24B37/00; (IPC1-7): C09G1/02; H01L21/00; H01L21/321; H01L21/306
Domestic Patent References:
| WO2000036037A1 | 2000-06-22 | |||
| WO2001078116A2 | 2001-10-18 |
Foreign References:
| US4169337A | 1979-10-02 | |||
| US5938505A | 1999-08-17 |
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