Title:
ALLOWANCE SETTING SYSTEM, SUBSTRATE INSPECTION DEVICE, ALLOWANCE SETTING METHOD, AND SUBSTRATE INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255412
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing: an allowance setting system (2) that can appropriately set inspection allowances; a substrate inspection device (33); a allowance setting method; and a substrate inspection method. Normal position (A) is the normal mounting position of an electronic component (91) on a component mounting surface of a substrate (9). Surface-direction deviations (BX, BY) are the deviations of the actual mounting position of the electronic component (91) from normal position (A) in the surface directions of the component mounting surface. Angular deviation (Bθ) is the deviation of the actual mounting position of the electronic component (91) from normal position (A) in the direction of rotation on the component mounting surface. In accordance with angular deviation (Bθ), the allowance setting system (2) sets a plurality of surface-direction inspection allowances (CX, CY) for evaluating surface-direction deviations (BX, BY) during a pre-reflow substrate inspection.
Inventors:
YOKOI YUTA (JP)
INAGAKI MITSUTAKA (JP)
KOTANI KAZUYA (JP)
ONO KEIICHI (JP)
INAGAKI MITSUTAKA (JP)
KOTANI KAZUYA (JP)
ONO KEIICHI (JP)
Application Number:
PCT/JP2019/024830
Publication Date:
December 24, 2020
Filing Date:
June 21, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08
Domestic Patent References:
| WO2015011753A1 | 2015-01-29 | |||
| WO2014080502A1 | 2014-05-30 |
Foreign References:
| JP2008072035A | 2008-03-27 | |||
| JP2002084097A | 2002-03-22 |
Other References:
See also references of EP 3989696A4
Attorney, Agent or Firm:
HIGASHIGUCHI Michiaki et al. (JP)
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