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Patent Searching and Data


Title:
ALLOY BOARD, AND COMPOSITE BOARD COMPRISING ALLOY BOARD
Document Type and Number:
WIPO Patent Application WO/2020/181653
Kind Code:
A1
Abstract:
Disclosed is an alloy board, comprising a board body (1), wherein a plurality of punching pieces (2) are stamped out from the board body (1), the punching pieces (2) are connected to the board body (1) by means of reserved turning edges (3), the punching pieces (2) are turned around the turning edges (3) to be separated from a plane of the board body (1), and punched holes (13) are correspondingly formed in positions, separated from the punching pieces (2), on the board body (1). An upper polymer material surface layer (11) and a lower polymer material surface layer (12) are respectively combined with two faces of the alloy board, and the upper polymer material surface layer (11) and the lower polymer material surface layer (12) pass through the punched holes (13) and are integrally formed in a fused manner. According to the alloy board, on the premise of not increasing the thickness of a board, the rigidity of the board itself is improved by means of turning punching pieces, and a punching material that should be discarded is turned into wealth, thereby saving on materials; and upper and lower layers of polymer materials are softened and then fused by means of punched holes, so that several layers of different materials are firmly bonded together.

Inventors:
WANG HAIFENG (CN)
Application Number:
PCT/CN2019/087401
Publication Date:
September 17, 2020
Filing Date:
May 17, 2019
Export Citation:
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Assignee:
JIANGSU BONNY LIGHT METAL TECH CO LTD (CN)
International Classes:
E04F13/077; B32B3/08; B32B3/24; B32B7/04; B32B15/06; B32B15/08; B32B15/20; B32B25/04; B32B27/06
Foreign References:
CN205553414U2016-09-07
CN205553414U2016-09-07
CN106042475A2016-10-26
CN205553418U2016-09-07
CN104234347A2014-12-24
CN206408927U2017-08-15
KR20110043066A2011-04-27
CN207686205U2018-08-03
Attorney, Agent or Firm:
WUXI JIAN HENG ZHUAN LI DAI LI SHI WU SUO (CN)
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