Title:
ALLOY MATERIAL FOR PROBE PINS
Document Type and Number:
WIPO Patent Application WO/2022/202681
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an alloy material for probe pins that makes it possible to suppress diffusion of components of a probe material and solder at a circuit connection part which is to be tested when a probe test is performed. An alloy material for probe pins according to the present invention is characterized by comprising 15-60 mass% of Pd, 3-79.9 mass% of Cu, and 0.1-75 mass% of Ni and/or Pt.
Inventors:
EGAWA YASUNORI (JP)
MATSUZAWA ATSUO (JP)
HASEGAWA KOICHI (JP)
IMAI YOSUKE (JP)
SATO KENICHI (JP)
MATSUZAWA ATSUO (JP)
HASEGAWA KOICHI (JP)
IMAI YOSUKE (JP)
SATO KENICHI (JP)
Application Number:
PCT/JP2022/012690
Publication Date:
September 29, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
ISHIFUKU METAL IND (JP)
YOKOWO SEISAKUSHO KK (JP)
YOKOWO SEISAKUSHO KK (JP)
International Classes:
C22C9/00; C22C30/02; G01R1/06
Domestic Patent References:
| WO2014049874A1 | 2014-04-03 |
Foreign References:
| JP2004093355A | 2004-03-25 | |||
| JP2017025354A | 2017-02-02 | |||
| JP2017145496A | 2017-08-24 | |||
| JP2016172887A | 2016-09-29 | |||
| US1935897A | 1933-11-21 |
Attorney, Agent or Firm:
TOMITA, Yoshimi (JP)
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