Title:
ALLOY MATERIAL FOR PROBE PINS
Document Type and Number:
WIPO Patent Application WO/2024/053552
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an alloy material for probe pins by which the diffusion of components of a probe material and solder at a circuit connection part to be tested during a probe test can be suppressed. The alloy material for probe pins according to the present invention comprises 40-95 mass% of Pt, 0.5-50 mass% of Cu, and 3-50 mass% of Ni.
Inventors:
HASEGAWA KOICHI (JP)
EGAWA YASUNORI (JP)
MATSUZAWA ATSUO (JP)
SATO KENICHI (JP)
EGAWA YASUNORI (JP)
MATSUZAWA ATSUO (JP)
SATO KENICHI (JP)
Application Number:
PCT/JP2023/031796
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
ISHIFUKU METAL IND (JP)
YOKOWO SEISAKUSHO KK (JP)
YOKOWO SEISAKUSHO KK (JP)
International Classes:
G01R1/067; C22C5/04; C22C9/00; C22C19/03; C22C30/02
Domestic Patent References:
| WO2012077378A1 | 2012-06-14 |
Foreign References:
| JP2002270654A | 2002-09-20 | |||
| JP2003149267A | 2003-05-21 | |||
| JP2010054496A | 2010-03-11 | |||
| JP2021113800A | 2021-08-05 | |||
| JPS5970740A | 1984-04-21 | |||
| JP2022151628A | 2022-10-07 | |||
| JP2022151627A | 2022-10-07 |
Attorney, Agent or Firm:
TOMITA Yoshimi (JP)
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