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Patent Searching and Data


Title:
TIN/TIN ALLOY NANOPARTICLE HAVING LOW MELTING TEMPERATURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/096489
Kind Code:
A3
Abstract:
Disclosed are a nanoparticle having a size of 1-20nm prepared by electrolyzing a tin or a tin alloy, and a method for preparing same. The nanoparticle surface-melts in a temperature range of 80-130℃. A solder ball having the nanoparticle can be sintered at or below 160℃, and can thus, first, save 22% of energy by resolving the energy consumption of 74 kW for the conventionally used reflow processing device to an energy consumption of 50 kW by enabling the heating temperature to be lowered from 240℃ to 160℃ during reflow process. Second, deformation of a PCB board can be minimized by enabling the temperature for the reflow process to be lowered, and application areas for implementation materials having a low unit cost can be created by enabling the use of low cost polymer materials such as PET having low glass transition temperature. And third, the uniformity of a solder paste on a pad can be enhance when using a nanoparticle having a size of 10 nm or smaller, and in the case of a nano-solder ink, the limitations of micro-patterning can be overcome due to the small size of the particle (Figure 4).

Inventors:
KIM YOUNG SANG (KR)
Application Number:
PCT/KR2012/000223
Publication Date:
November 29, 2012
Filing Date:
January 10, 2012
Export Citation:
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Assignee:
ISP CO LTD (KR)
KIM YOUNG SANG (KR)
CHO KYUNG JIN (KR)
JANG SEOK PIL (KR)
LEE JONG HYUN (KR)
KIM HYUN SOO (KR)
International Classes:
B22F1/00; B22F1/054; B23K35/26; C25C5/02
Foreign References:
KR20100019867A2010-02-19
KR20080010691A2008-01-31
JP2000246483A2000-09-12
KR20100086682A2010-08-02
Attorney, Agent or Firm:
YU, Jong Wan (553 Dowha-dongMapo-gu, Seoul 121-748, KR)
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Claims: