Title:
ALLOY SOLDER, AND PREPARATION METHOD THEREFOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/101436
Kind Code:
A1
Abstract:
Provided is a low-temperature alloy solder, comprising, in parts by weight: 17-35 parts of tin, 20-45 parts of lead, 20-40 parts of bismuth, 0.1-2 parts of indium, 0.1-0.5 parts of antimony, 0.01-0.2 parts of phosphorus and 0.01-0.8 parts of a rare earth element. The alloy solder takes a tin-lead-bismuth three-phase alloy as a main component, has a melting point lower than 145°C, is suitable for a laminating process of a photovoltaic module, and realizes the integration of the welding process and the laminating process of a main-grid-free battery. Further disclosed is a preparation method for the alloy solder and a use thereof.
Inventors:
YANG ZHENYING (CN)
HE FENGQIN (CN)
LI JIALIANG (CN)
LU GANG (CN)
ZHANG ZHI (CN)
GUO LINGSHAN (CN)
HE FENGQIN (CN)
LI JIALIANG (CN)
LU GANG (CN)
ZHANG ZHI (CN)
GUO LINGSHAN (CN)
Application Number:
PCT/CN2016/089967
Publication Date:
June 22, 2017
Filing Date:
July 14, 2016
Export Citation:
Assignee:
WANG NENGQING (CN)
International Classes:
B23K35/26
Domestic Patent References:
| WO2015111587A1 | 2015-07-30 |
Foreign References:
| CN105382443A | 2016-03-09 | |||
| CN104400248A | 2015-03-11 | |||
| CN104070299A | 2014-10-01 | |||
| JP2008168339A | 2008-07-24 |
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