Title:
ALLOY TO BE PLATED, ITS PLATING METHOD AND PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/1994/018350
Kind Code:
A1
Abstract:
When an electronic component and a wiring board are connected to each other by soldering, the present invention uses, as an alloy to be plated, an alloy containing 0.01 to 90 wt% of palladium in lead, tin or their alloy as a thin film to be formed on a to-be-plated portion of the electronic component or the wiring board so as to effectively carry out the connection. Particularly preferred is an alloy containing 0.1 to 70 wt% of lead, 0.1 to 90 wt% of tin and 0.01 to 90 wt% of palladium. Furthermore, when this alloy further contains 0.1 to 20 wt% of phosphorus or 0.01 to 10 wt% of boron, the drop of solderability of the alloy due to heat can be much more reduced. When 0.1 to 20 wt% of indium is contained, the melting point of the alloy can be lowered and when 0.1 to 20 wt% of silver is contained, leaching can be reduced. This alloy to be plated is preferably formed on the to-be-plated portion by electrolytic or electroless plating by the use of a plating solution for the alloy to be plated which contains 0.001 to 2 mols/l of a palladium compound, 0.001 to 3 mols/l of a tin compound and or 0.001 to 2 mols/l of a lead compound. In the case of electroless plating, it is preferred to use a plating solution additionally containing 0.01 to 1 mol/l of a reducing agent.
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Inventors:
UEDA SHIGEAKI (JP)
HAYASHIDA HIDENORI (JP)
HAYASHIDA HIDENORI (JP)
Application Number:
PCT/JP1993/000129
Publication Date:
August 18, 1994
Filing Date:
February 03, 1993
Export Citation:
Assignee:
WORLD METAL CO LTD (JP)
UEDA SHIGEAKI (JP)
HAYASHIDA HIDENORI (JP)
UEDA SHIGEAKI (JP)
HAYASHIDA HIDENORI (JP)
International Classes:
B23K35/00; B23K35/26; C23C30/00; H05K3/34; (IPC1-7): C22C13/00; B23K1/20; C22C5/04; C22C11/06; C23C30/00; H05K3/42
Foreign References:
| JPS5216432A | 1977-02-07 |
Other References:
See also references of EP 0638656A4
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