Title:
ALUMINIUM ALLOY-COPPER ALLOY BOND, AND BONDING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2013/081021
Kind Code:
A3
Abstract:
The present invention provides an aluminium alloy-copper alloy bond and a method for same, the bond being bonded by means of a novel aluminium alloy-copper alloy bonding method which exhibits excellent bonding properties, little material deformation during bonding, and excellent reliability. A bond in which one member to be bonded is an aluminium alloy, an other member to be bonded is a copper alloy, and the one member to be bonded and the other member to be bonded are metallic bonded, wherein: the one member to be bonded is an aluminium alloy including 3.0-8.0 mass% Cu and 0.1-10 mass% Si, with the remainder being Al and unavoidable impurities, and satisfies C+2.4xS≥7.8 where C (mass%) is the Cu concentration and S (mass%) is the Si concentration; and the other member to be bonded is a copper alloy having a higher solidus temperature than the one member to be bonded.
Inventors:
KITAWAKI KOTARO (JP)
MURASE TAKASHI (JP)
MURASE TAKASHI (JP)
Application Number:
PCT/JP2012/080779
Publication Date:
August 08, 2013
Filing Date:
November 28, 2012
Export Citation:
Assignee:
FURUKAWA SKY ALUMINUM CORP (JP)
International Classes:
B23K20/00; B23K20/16; B23K20/233; B23K35/362; B32B15/01; C22C21/02; C22C21/12; C22C9/04
Domestic Patent References:
| WO2011152556A1 | 2011-12-08 |
Foreign References:
| JP2003048077A | 2003-02-18 | |||
| JPS58168487A | 1983-10-04 | |||
| JPH10180463A | 1998-07-07 | |||
| JP2001334371A | 2001-12-04 | |||
| JPS54133450A | 1979-10-17 |
Other References:
See also references of EP 2786831A4
Attorney, Agent or Firm:
OHASHI Kunihiko (6th Floor 19-7 Hongo 3-chom, Bunkyo-ku Tokyo 33, JP)
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Claims: