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Patent Searching and Data


Title:
ALUMINUM ALLOY FOR DIE CASTING THIN-WALLED PRODUCTS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/216083
Kind Code:
A1
Abstract:
According to various embodiments, an aluminum alloy for die casting thin-walled products may comprise, with respect to the total weight of the alloy, 9.0-11.0 wt% of silicon (Si), 1.0-1.3 wt% of magnesium (Mg), 0.0001-0.9 wt% of iron (Fe), 0.0001 wt% or greater and less than 0.1 wt% of copper (Cu), greater than 2.0 wt% and 3.0 wt% or less of zinc (Zn), an amount of strontium (Sr) satisfying the Sr content ratio to follow, and the balance of aluminum (Al), wherein the Sr content ratio may be in the range of (wt% of Si - 1.74 x wt% of Mg):wt% of Sr = 200–1,000:1. Various other embodiments may be possible.

Inventors:
CHOI BYOUNGHEE (KR)
LEE JINHO (KR)
HWANG YONGWOOK (KR)
Application Number:
PCT/KR2022/005043
Publication Date:
October 13, 2022
Filing Date:
April 07, 2022
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
C22C21/02; B22D11/00; B22D21/00; C22F1/043
Foreign References:
KR20200142980A2020-12-23
KR20150086837A2015-07-29
KR20210024575A2021-03-05
JP2019104953A2019-06-27
JP2009108409A2009-05-21
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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