Title:
ALUMINUM ALLOY FOIL AND METHOD FOR PRODUCING SAME, MOLDED PACKAGING MATERIAL, SECONDARY CELL, AND MEDICAL DRUG CONTAINER
Document Type and Number:
WIPO Patent Application WO/2013/168606
Kind Code:
A1
Abstract:
Provided is an aluminum alloy foil having good moldability. Provided is an aluminum alloy foil comprising 0.8 to 2.0 mass% of Fe, 0.05 to 0.2 mass% of Si, and 0.0025 to 0.2 mass% of Cu, with the remainder being Al and inevitable impurities. According to the aluminum alloy foil, cube orientation density is 5 or greater and R orientation density is 50 or less in the crystal orientation of the aluminum alloy foil surface. The average crystal grain size of the aluminum alloy foil is 7 to 20 µm.
Inventors:
SEKI MASAKAZU (JP)
SUZUKI SATOSHI (JP)
SUZUKI SATOSHI (JP)
Application Number:
PCT/JP2013/062396
Publication Date:
November 14, 2013
Filing Date:
April 26, 2013
Export Citation:
Assignee:
FURUKAWA SKY ALUMINUM CORP (JP)
International Classes:
C22C21/00; B32B15/08; B65D75/32; B65D83/04; C22F1/04; H01M50/119; H01M50/121; H01M50/129; H01M50/131; C22F1/00
Domestic Patent References:
| WO2012036181A1 | 2012-03-22 |
Foreign References:
| JP2012052158A | 2012-03-15 | |||
| JP2007308805A | 2007-11-29 |
Other References:
MASASHI SAKAGUCHI: "Relationship between tensile properties and recrystallized structures of Al-1.2%Fe-Si alloy foils", JOURNAL OF JAPAN INSTITUTE OF LIGHT METALS, vol. 38, no. 2, 1988, pages 84 - 90
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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