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Title:
ALUMINUM ALLOY MATERIAL, BONDED OBJECT, AND AUTOMOTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/031940
Kind Code:
A1
Abstract:
The present invention relates to an Al-Mg-Si aluminum alloy material containing Sn, the aluminum alloy material being characterized in that when an oxide film formed on the surface is subjected to semi-quantitative analysis by X-ray photoelectron spectroscopy, the ratio of the number of Sn atoms to the number of Mg atoms in the oxide film, Sn/Mg, is in the range of 0.001-3 on average and the ratio of the total number of Sn and Mg atoms to the number of oxygen atoms, (Sn+Mg)/O, is in the range of 0.001-0.2 on average. This aluminum alloy material is applicable as automotive members, e.g., automotive panels, which are bonded to a member using an adhesive.

Inventors:
OZAWA TAKAHIRO
TAKADA SATORU
TATSUMI AKIHIKO
Application Number:
PCT/JP2015/074300
Publication Date:
March 03, 2016
Filing Date:
August 27, 2015
Export Citation:
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Assignee:
KOBE STEEL LTD (JP)
International Classes:
C23C26/00; C22C21/02; C22C21/06; C22F1/00; C22F1/05; C23C28/00; C23F17/00
Foreign References:
JP2006009140A2006-01-12
JP2012031479A2012-02-16
JPH10113724A1998-05-06
JPH01319692A1989-12-25
JPH01240675A1989-09-26
JPH04214835A1992-08-05
Other References:
KATSUYOSHI KONDO ET AL.: "Behavior of Magnesium and Tin at the Surface of Aluminum-Silicon- Magnesium-Tin Alloy Powder Particles at Elevated Temperature and Their Effect on Direct Nitriding Reaction", JOURNAL OF THE JAPAN INSTITUTE OF METALS, vol. 64, no. 11, 2000, pages 1106 - 1112
Attorney, Agent or Firm:
Eikoh Patent Firm, P. C. et al. (JP)
Patent business corporation glory patent firm (JP)
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