Title:
ALUMINUM-BONDING ALLOY, CLAD MATERIAL HAVING BONDING ALLOY LAYER FORMED FROM THE ALLOY, AND COMPOSITE MATERIAL INCLUDING BONDED ALUMINUM
Document Type and Number:
WIPO Patent Application WO/2011/052517
Kind Code:
A1
Abstract:
Provided is an aluminum-bonding alloy which has excellent pressure weldability, diffusion bondability, and brazability not only to non-aluminum metals such as steel, copper, and nickel but also to aluminum. Also provided are a clad material having a bonding alloy layer formed from the bonding alloy, and a composite material including bonded aluminum.
The bonding alloy is an Ni-Mg alloy for bonding aluminum to a non-aluminum metal selected from steel, copper, nickel, and titanium. The Ni-Mg alloy consists essentially of 0.08-0.90 mass% Mg and, as the remainder, Ni and incidental impurities. The clad material comprises a non-aluminum metal layer (2) constituted of the non-aluminum metal and a bonding alloy layer (1) formed from the aluminum-bonding alloy, the non-aluminum metal layer (2) and the bonding alloy layer (1) having been bonded to each other by pressure welding and diffusion welding.
Inventors:
YAMAMOTO Shinji (2-19-1, Minamisuita, Suita-sh, Osaka 43, 〒5640043, JP)
山本 晋司 (〒43 大阪府吹田市南吹田２丁目１９番１号 株式会社ＮＥＯＭＡＸマテリアル内 Osaka, 〒5640043, JP)
山本 晋司 (〒43 大阪府吹田市南吹田２丁目１９番１号 株式会社ＮＥＯＭＡＸマテリアル内 Osaka, 〒5640043, JP)
Application Number:
JP2010/068801
Publication Date:
May 05, 2011
Filing Date:
October 25, 2010
Export Citation:
Assignee:
NEOMAX MATERIALS CO., LTD. (2-19-1, Minamisuita Suita-sh, Osaka 43, 〒5640043, JP)
株式会社ＮＥＯＭＡＸマテリアル (〒43 大阪府吹田市南吹田２丁目１９番１号 Osaka, 〒5640043, JP)
YAMAMOTO Shinji (2-19-1, Minamisuita, Suita-sh, Osaka 43, 〒5640043, JP)
株式会社ＮＥＯＭＡＸマテリアル (〒43 大阪府吹田市南吹田２丁目１９番１号 Osaka, 〒5640043, JP)
YAMAMOTO Shinji (2-19-1, Minamisuita, Suita-sh, Osaka 43, 〒5640043, JP)
International Classes:
B23K35/30; B23K1/19; B23K20/00; B23K20/04; B23K35/22; C22C19/03; B23K101/40; B23K103/18
Attorney, Agent or Firm:
HONDA Tatsuo (HONDA PATENT OFFICE, Pressance Shin-Osaka Station Front 1-18-26-902, Higashinakajima, Higashiyodogawa-ku, Osaka-sh, Osaka 33, 〒5330033, JP)
Download PDF: