Title:
ALUMINUM-DIAMOND COMPOSITE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/007922
Kind Code:
A1
Abstract:
Disclosed is an aluminum-diamond composite having both high thermal conductivity and thermal expansion coefficient close to those of semiconductor elements, which is improved in platability in the surface and surface roughness so that the composite becomes suitable for use as a heatsink of a semiconductor element or the like.
Specifically disclosed is a plate-like aluminum-diamond composite containing diamond particles and a metal mainly composed of aluminum. The aluminum-diamond composite is composed of a composite part and surface layers formed on both sides of the composite part, and the surface layers are composed of a material containing a metal mainly composed of aluminum. The diamond particle content is 40-70% by volume of the entire aluminum-diamond composite.
Inventors:
HIROTSURU Hideki (1 Shinkai-machi, Omuta-sh, Fukuoka 10, 〒8368510, JP)
廣津留 秀樹 (〒10 福岡県大牟田市新開町１ 電気化学工業株式会社 大牟田工場内 Fukuoka, 〒8368510, JP)
廣津留 秀樹 (〒10 福岡県大牟田市新開町１ 電気化学工業株式会社 大牟田工場内 Fukuoka, 〒8368510, JP)
Application Number:
JP2009/062445
Publication Date:
January 21, 2010
Filing Date:
July 08, 2009
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 38, 〒1038338, JP)
電気化学工業株式会社 (〒38 東京都中央区日本橋室町二丁目１番１号 Tokyo, 〒1038338, JP)
HIROTSURU Hideki (1 Shinkai-machi, Omuta-sh, Fukuoka 10, 〒8368510, JP)
電気化学工業株式会社 (〒38 東京都中央区日本橋室町二丁目１番１号 Tokyo, 〒1038338, JP)
HIROTSURU Hideki (1 Shinkai-machi, Omuta-sh, Fukuoka 10, 〒8368510, JP)
International Classes:
B22D19/00; B22D18/02; C22C1/10; H01L23/373
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (SONODA & KOBAYASHI, 53rd Floor Shinjuku Mitsui Building, 1-1, Nishi-Shinjuku 2-chome, Shinjuku-k, Tokyo 53, 〒1630453, JP)