ALUMINUM FILM MANUFACTURING METHOD AND MANUFACTURING DEVICE

WIPO Patent Application WO/2015/118977

A1

The purpose of the present invention is to provide an aluminum film manufacturing method and manufacturing device with which there is no intrusion of moisture or oxygen into a plating chamber. Provided is an aluminum film manufacturing method in which, in a molten salt electrolytic solution, aluminum is electrodeposited onto the surface of a long and elongated porous resin substrate to which conductivity was imparted. The aluminum film manufacturing method includes the following: a step in which a substrate (W) passes through a seal chamber (4) disposed at the entrance side of a plating chamber (1) and is thereby loaded into the plating chamber; a step in which an aluminum film is electrodeposited onto the surface of the substrate (W) in the plating chamber (1); and a step in which the substrate onto which the aluminum film was electrodeposited passes through a seal chamber (5) disposed at the exit side of the plating chamber (1) and is thereby loaded out of the plating chamber (1). An inert gas is supplied into the plating chamber so that the plating chamber has a positive pressure with respect to the outside air, and the inert gas is forcibly exhausted from inert gas exhaust pipes (7) provided to each of the two seal chambers.

NISHIMURA JUNICHI (JP)
HOSOE AKIHISA (JP)
OKUNO KAZUKI (JP)
KIMURA KOUTAROU (JP)
GOTO KENGO (JP)
SAKAIDA HIDEAKI (JP)
MOTOMURA JUNICHI (JP)

PCT/JP2015/051983

August 13, 2015

January 26, 2015

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SUMITOMO ELECTRIC INDUSTRIES (JP)

C25D1/08; C25D1/00; C25D3/66; C25D7/06

JP2012255185A	2012-12-27
JPH04329898A	1992-11-18
JP2002030480A	2002-01-31
JPS61213389A	1986-09-22
JPH0317292A	1991-01-25

See also references of EP 3103895A4

NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)

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