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Title:
ALUMINUM FOIL, ELECTRONIC COMPONENT WIRING BOARD, AND ALUMINUM FOIL MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/182589
Kind Code:
A1
Abstract:
　The purpose of the present invention is to provide aluminum foil having excellent adhesion to solder. This aluminum foil contains Sn and/or Bi, and the ratio of the total mass of Sn and Bi to the overall mass of the aluminum foil is 0.0075 mass% to 15 mass%, inclusive.

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Inventors:
AKIYAMA SOTARO (JP)
NISHIO YOSHITAKA (JP)
Application Number:
PCT/JP2015/065056
Publication Date:
December 03, 2015
Filing Date:
May 26, 2015
Export Citation:
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Assignee:
TOYO ALUMINIUM KK (JP)
International Classes:
C22C21/00; B21B3/00; C22F1/04; C22F1/00
Foreign References:
JP2001525488A2001-12-11
JPS6033896A1985-02-21
JP2004521190A2004-07-15
Other References:
See also references of EP 3150731A4
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
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