Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ALUMINUM PLATING FILM AND PRODUCTION METHOD FOR ALUMINUM PLATING FILM
Document Type and Number:
WIPO Patent Application WO/2018/211740
Kind Code:
A1
Abstract:
Provided is an aluminum plating film which consists chiefly of aluminum and which has, between coated surfaces at both ends in the thickness direction thereof, an interposition layer containing a metal that has a lower ionization tendency than aluminum or an interposition layer containing an alloy of aluminum and a metal that has a lower ionization tendency than aluminum.

More Like This:
JP2010126766PLATED BASE MATERIAL HAVING Sn PLATING LAYER AND METHOD OF MANUFACTURING THE SAME
JPH04116193MULTILAYERED ELECTROLYTIC CHROMATE TREATED STEEL PLATE HAVING EXCELLENT CORROSION RESISTANCE AND WELDABILITY
Inventors:
GOTO KENGO (JP)
HOSOE AKIHISA (JP)
SAKAIDA HIDEAKI (JP)
Application Number:
PCT/JP2018/001568
Publication Date:
November 22, 2018
Filing Date:
January 19, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C25D5/10; C25D1/08; C25D1/20; C25D3/66; C25D7/00
Foreign References:
JPH10102207A1998-04-21
JPS53114710A1978-10-06
JP2012256584A2012-12-27
JP2012149282A2012-08-09
JPH07138792A1995-05-30
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: HOISTING MACHINE

Next Patent: ELECTRONIC DRUM