Title:
ALUMINUM PLATING SOLUTION, ALUMINUM FILM, RESIN STRUCTURE, POROUS ALUMINUM OBJECT, AND POROUS ALUMINUM OBJECT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/111533
Kind Code:
A1
Abstract:
Provided is an aluminum plating solution with a large current density region in which aluminum plating is possible and small solution resistance. An aluminum plating solution comprises: an aluminum halide; one or more species selected from a group consisting of alkyl imidazolium halides, alkyl pyridinium halides and urea compounds; and an ammonium salt represented by general formula (1). The concentration of the ammonium salt is 1 g/L to 45 g/L.
NR4
+∙X- ... general formula (1)
In the general formula, R represents a hydrogen atom or an alkyl group of not more than 15 carbons that may have a side chain, and X represents a halogen atom. The Rs may be the same or different from each other.
Inventors:
GOTO KENGO (JP)
HOSOE AKIHISA (JP)
NISHIMURA JUNICHI (JP)
OKUNO KAZUKI (JP)
KIMURA KOUTAROU (JP)
SAKAIDA HIDEAKI (JP)
MOTOMURA JUNICHI (JP)
HOSOE AKIHISA (JP)
NISHIMURA JUNICHI (JP)
OKUNO KAZUKI (JP)
KIMURA KOUTAROU (JP)
SAKAIDA HIDEAKI (JP)
MOTOMURA JUNICHI (JP)
Application Number:
PCT/JP2015/051179
Publication Date:
July 30, 2015
Filing Date:
January 19, 2015
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C25D3/66; C25D1/08; C25D7/00
Domestic Patent References:
| WO2010089991A1 | 2010-08-12 |
Foreign References:
| JP2010232171A | 2010-10-14 | |||
| JP2013011003A | 2013-01-17 | |||
| JP2012007233A | 2012-01-12 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
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