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Patent Searching and Data


Title:
ALUMINUM RESIN BONDED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/047365
Kind Code:
A1
Abstract:
Provided is an aluminum resin bonded body which exhibits excellent bonding strength, does not suffer from strength decrease after endurance test, and is capable of maintaining the excellent bonding strength for a long period of time. An aluminum resin bonded body which comprises: an aluminum base that is formed of aluminum or an aluminum alloy; an oxygen-containing film that is formed on the surface of the aluminum base and contains oxygen; and a resin molded body that is bonded onto the oxygen-containing film and is formed of a thermoplastic resin. The thermoplastic resin contains an element that has an unshared electron pair in a repeating unit and/or at an end.

Inventors:
IINO MASAKI (JP)
ENDO MASANORI (JP)
YOSHIDA MIYUKI (JP)
ISOBE MASASHI (JP)
Application Number:
PCT/JP2012/074216
Publication Date:
April 04, 2013
Filing Date:
September 21, 2012
Export Citation:
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Assignee:
NIPPON LIGHT METAL CO (JP)
International Classes:
B29C45/14; B29C65/64; B29K67/00; B29K81/00; B29K105/22
Domestic Patent References:
WO2009151099A12009-12-17
Foreign References:
JP2011156764A2011-08-18
JP2011052292A2011-03-17
JP2010173298A2010-08-12
JP2010174372A2010-08-12
JP3954379B22007-08-08
JP4270444B22009-06-03
JPH0551671B21993-08-03
JP3016331B22000-03-06
JP2003103562A2003-04-09
Other References:
See also references of EP 2762289A4
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
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Claims: