Title:
ALUMINUM RESIN BONDED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/024877
Kind Code:
A1
Abstract:
Provided is an aluminum resin bonded body which manifests excellent bonding strength, does not suffer a decline in strength after a durability test, and is able to maintain excellent bonding strength over the long term. The present invention is an aluminum resin bonded body includes: an aluminum base material comprising aluminum or aluminum alloy; an oxygen-containing coating containing oxygen formed on the surface of the aluminum base material; and a resin molding that is bonded onto the oxygen-containing coating and is formed of a thermoplastic resin composition containing a thermoplastic resin and an additive; the thermoplastic resin composition containing a thermoplastic resin having an unshared electron pair in the repeating units and/or at a terminus and/or an additive comprising an element having an unshared electron pair.
Inventors:
ENDO MASANORI (JP)
TAKASAWA REIKO (JP)
YOSHIDA MIYUKI (JP)
TAKASAWA REIKO (JP)
YOSHIDA MIYUKI (JP)
Application Number:
PCT/JP2013/071239
Publication Date:
February 13, 2014
Filing Date:
August 06, 2013
Export Citation:
Assignee:
NIPPON LIGHT METAL CO (JP)
International Classes:
B32B15/08; B29C45/14; B29C65/02; B29C65/70; C23C8/16; C23C22/08; C23C22/66; C25D11/04; B29K23/00; B29K59/00; B29K67/00; B29K71/00; B29K79/00; B29K81/00
Domestic Patent References:
| WO1997035716A1 | 1997-10-02 | |||
| WO2013047365A1 | 2013-04-04 | |||
| WO1994009969A1 | 1994-05-11 |
Foreign References:
| JP2006026912A | 2006-02-02 | |||
| JP2011173353A | 2011-09-08 | |||
| JP2003103562A | 2003-04-09 | |||
| JP2011076887A | 2011-04-14 | |||
| JP2010149511A | 2010-07-08 | |||
| JPS62227723A | 1987-10-06 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
Kazuya Sasaki (JP)
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