Title:
AMPLIFICATION DEVICE AND MATCHING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/200963
Kind Code:
A1
Abstract:
This amplification device comprises a base substrate, an amplification element, and a matching circuit board. The amplification element is mounted on the base substrate. The matching circuit board is mounted on the base substrate and has a circuit pattern electrically connected to the amplification element. The matching circuit board has a first side surface and a second side surface, each of which extend in the longitudinal direction of the matching circuit board. A first recess is provided in the first side surface. A second recess, which faces the first recess, is provided in the second side surface.
Inventors:
MINAMI TADASHI (JP)
Application Number:
PCT/JP2021/013568
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
Assignee:
SEDI INC (JP)
International Classes:
H03F1/30; H03F3/189
Foreign References:
| JP2016219461A | 2016-12-22 | |||
| JP2002335136A | 2002-11-22 | |||
| JP2005129552A | 2005-05-19 | |||
| JP2002076528A | 2002-03-15 | |||
| JP2018085613A | 2018-05-31 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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