Title:
ANALYSIS DEVICE AND ANALYSIS METHOD
Document Type and Number:
WIPO Patent Application WO/2016/056109
Kind Code:
A1
Abstract:
Provided are a device and method with which a heat source position corresponding to a failure point can be specified. This analysis device, which specifies a heat source position in a semiconductor device, is provided with a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device corresponding to the AC signal and outputs a detection signal, and a data analysis unit that specifies a heat source position on the basis of the detection signal.
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| JPH06201338 | OUTER APPEARANCE STATE INSPECTION |
| WO/2017/222797 | SUBSTRATE TEMPERATURE MONITORING |
Inventors:
NAKAMURA TOMONORI (JP)
Application Number:
PCT/JP2014/077098
Publication Date:
April 14, 2016
Filing Date:
October 09, 2014
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/66; G01N25/72; G01R31/26
Foreign References:
| JPH09266238A | 1997-10-07 | |||
| JPS63134943A | 1988-06-07 | |||
| JPH04249336A | 1992-09-04 |
Other References:
See also references of EP 3206226A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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