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Patent Searching and Data


Title:
ANALYSIS SUBSTRATE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/146700
Kind Code:
A1
Abstract:
This analysis substrate (10) comprises: a substrate (1) having at least a first surface (1a) that comprises a dielectric or a semiconductor; and a metal membrane (3) provided upon the first surface (1a) of the substrate (1). The metal membrane (3) has a plurality of non-film-formation areas (G) that: are provided inside the metal membrane (3) as island-shaped gaps having a length in the long-axis direction of no more than 1 µm; do not have metal present therein; and have the first surface (1a) exposed therein. The surface sheet resistance of the metal membrane (3) at 25°C is 3–5,000 Ω/□.

Inventors:
SHINOTSUKA KEI (JP)
DAI KOTARO (JP)
MIURA SHOGO (JP)
Application Number:
PCT/JP2019/002276
Publication Date:
August 01, 2019
Filing Date:
January 24, 2019
Export Citation:
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Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
G01N21/65; B82Y30/00; B82Y40/00; G01N21/41; G01N21/35; G01N21/64
Domestic Patent References:
WO2014025035A12014-02-13
WO2010088726A12010-08-12
Foreign References:
US20110267610A12011-11-03
JP2012132875A2012-07-12
JP2015163845A2015-09-10
JP2015055482A2015-03-23
US20120170033A12012-07-05
JP2014163868A2014-09-08
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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