Title:
ANISOTROPIC CONDUCTION SHEET MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/194824
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an easily-manufacturable anisotropic conduction sheet which can be used for inspection of high frequency components and semiconductor packages in which wirings are laid at a narrow pitch and the wirings are formed of thin wires. The anisotropic conduction sheet manufacturing method is characterized by comprising: a molding step for molding, into a sheet-like body, a conductive filler-containing composition that contains (A) a conductive filler dispersed in an organic solvent and (B) a binder resin; and an organic solvent volatilization step for volatilizing the organic solvent from one surface of the sheet-like body by applying heat to the other surface of the sheet-like body.
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Inventors:
MORITA MINORU (JP)
Application Number:
PCT/JP2019/041760
Publication Date:
October 01, 2020
Filing Date:
October 24, 2019
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01R43/00; H01B1/24; H01B5/16; H01B13/00; H01R11/01
Foreign References:
| JP2005149764A | 2005-06-09 | |||
| JP2006159569A | 2006-06-22 | |||
| US20130222975A1 | 2013-08-29 | |||
| JP2009076431A | 2009-04-09 | |||
| JP2005116291A | 2005-04-28 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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