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Patent Searching and Data


Title:
ANISOTROPIC CONDUCTIVE ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2015/141342
Kind Code:
A1
Abstract:
Provided is an anisotropic conductive adhesive agent with which it is possible to obtain high heat-dissipation properties. The present invention contains: conductive particles (31) in which a conductive metal layer is formed on the surface of resin particles; solder particles (32) having a smaller average size than the conductive particles; and a binder in which the conductive particles (31) and the solder particles (32) are dispersed. The conductive particles (31) are deformed into a flat shape by being pressed during crimping, thereby electrically connecting terminals. Moreover, the terminals are solder joined by means of the solder particles (32) having a smaller average size than the conductive particles (31). As a consequence, the contact area between opposing terminals increases and it is possible to obtain high heat-dissipation properties.

Inventors:
ISHIGAMI AKIRA (JP)
KANISAWA SHIYUKI (JP)
NAMIKI HIDETSUGU (JP)
AOKI MASAHARU (JP)
Application Number:
PCT/JP2015/053956
Publication Date:
September 24, 2015
Filing Date:
February 13, 2015
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01B5/16; C09J9/02; C09J201/00; H01L21/60; H05K3/32; H05K3/34
Foreign References:
JP2014017248A2014-01-30
JPH03129607A1991-06-03
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
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