Title:
ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES
Document Type and Number:
WIPO Patent Application WO/2008/038565
Kind Code:
A1
Abstract:
An anisotropic conductive adhesive composition is provided for connecting
a first circuit member, which has a first circuit electrode on the main surface
of a first substrate, and a second circuit member, which has a second circuit electrode
on the main surface of a second substrate, in a status where the first circuit electrode
and the second circuit electrode are arranged to face each other. The anisotropic
conductive adhesive composition contains an adhesive, and coated particles
wherein at least the surfaces of the conductive particles are partially coated
with an insulating material containing a polymeric electrolytic material and
inorganic oxide fine particles.
Inventors:
TAKANE, Nobuaki (HITACHI CHEMICAL COMPANY LTD., 48, Wadai, Tsukuba-sh, Ibaraki 47, 3004247, JP)
Application Number:
JP2007/068265
Publication Date:
April 03, 2008
Filing Date:
September 20, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 1630449, JP)
International Classes:
H01R11/01; C09J9/02; C09J11/04; C09J201/00; H01B1/20; H01B5/00; H01B13/00; H01L21/60; H05K1/14; H05K3/32; H05K3/36
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (SOEI PATENT AND LAW FIRM, Ginza First Bldg.10-6, Ginza 1-chome, Chuo-k, Tokyo 61, 1040061, JP)
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