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Title:
ANISOTROPIC CONDUCTIVE ADHESIVE FILM, CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/086278
Kind Code:
A1
Abstract:
Provided is an anisotropic conductive adhesive film for anisotropic conductive connection of a terminal of a flexible substrate with a terminal of a rigid substrate, wherein conductive particles are employed having a particle size of at least 4 µm and a compressive hardness of at least 4500 kgf/mm2, such that the pressing-in ratio defined by 100∙(A - B)/A, where A is the particle size of the conductive particles after anisotropic conductive connection and B is the gap between the terminal of the flexible substrate and the terminal of the rigid substrate, is at least 40%. Also, the conductive particle sphericity expressed by a/b, where a is the maximum diameter of the conductive particles and b is the minimum diameter thereof, is no more than 5.

Inventors:
ARAKI YUTA (JP)
TAMAKI TAKESHI (JP)
TAKABAYASHI ASAEI (JP)
ISHIMATSU TOMOYUKI (JP)
Application Number:
PCT/JP2011/071580
Publication Date:
June 28, 2012
Filing Date:
September 22, 2011
Export Citation:
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Assignee:
SONY CHEM & INF DEVICE CORP (JP)
ARAKI YUTA (JP)
TAMAKI TAKESHI (JP)
TAKABAYASHI ASAEI (JP)
ISHIMATSU TOMOYUKI (JP)
International Classes:
H01R11/01; C09J7/10; C09J9/02; C09J11/00; C09J201/00
Domestic Patent References:
WO2009063827A12009-05-22
Foreign References:
JP2002124128A2002-04-26
JPH09312176A1997-12-02
JPH11134935A1999-05-21
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)
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Claims: