Title:
ANISOTROPIC CONDUCTIVE ADHESIVE FILM WITH CONTROLLED FLUIDITY OF CONDUCTIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/068558
Kind Code:
A1
Abstract:
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compressing process by fixing the conductive particles by means of strong force through a high modulus of a polymer. Particularly, a non-flowable conductive layer containing the conductive particles is formed through a semi-curing process to fix the conductive particles by the modulus force of a polymer resin, whereby the movement of the conductive particles is minimized when the resin flow is generated by pressure in a compressing process. In addition, an adhesive layer is formed above and below a semi-cured polymer film layer to improve properties, such as adhesive strength, reliability, and connection resistance, which are degraded due to the semi-cured film, thereby optimizing properties of the anisotropic conductive adhesive film.
Inventors:
KIM DONG WON (KR)
LEE KYU MAHN (KR)
KIM DONG SEOK (KR)
KO BYUNG UG (KR)
LEE KYU MAHN (KR)
KIM DONG SEOK (KR)
KO BYUNG UG (KR)
Application Number:
PCT/KR2022/013645
Publication Date:
April 27, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
H＆S HIGHTECH CORP (KR)
International Classes:
C09J9/02; C09J11/04; C09J163/00
Foreign References:
| KR20060123491A | 2006-12-01 | |||
| KR20180020520A | 2018-02-28 | |||
| KR20160012532A | 2016-02-03 | |||
| KR20160117455A | 2016-10-10 | |||
| KR20200087029A | 2020-07-20 |
Attorney, Agent or Firm:
JUNG, Seung Hun (KR)
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