Title:
ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING SAME, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/157552
Kind Code:
A1
Abstract:
The present invention provides technology for anisotropic conductive adhesive that uses conductive particles with a silver based metal for a conductive layer, has high light reflectivity, and has superior migration resistance properties. This anisotropic conductive adhesive (1) includes light reflective conductive particles (3) in an insulating adhesive resin (2). For the light reflective conductive particles (3), a light reflective metal layer (31) formed from an alloy that includes silver, gold, and hafnium is formed by sputtering on the surface of resin particles (30). The compositional ratio of the light reflective metal layer in the conductive particles (3) is preferably in a range of 50 - 80% by weight silver, 10 -45% by weight gold, and 10 - 40% by weight hafnium such that the total does not exceed 100% by weight.
Inventors:
NAMIKI HIDETSUGU (JP)
KANISAWA SHIYUKI (JP)
UMAKOSHI HIDEAKI (JP)
AOKI MASAHARU (JP)
ISHIGAMI AKIRA (JP)
KANISAWA SHIYUKI (JP)
UMAKOSHI HIDEAKI (JP)
AOKI MASAHARU (JP)
ISHIGAMI AKIRA (JP)
Application Number:
PCT/JP2013/061318
Publication Date:
October 24, 2013
Filing Date:
April 16, 2013
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/00; C22C5/06; H01B1/00; H01B1/22; H01B13/00; H01L33/50; H01R4/04; H01R11/01; H01R43/00
Domestic Patent References:
| WO2011030621A1 | 2011-03-17 | |||
| WO2013051708A1 | 2013-04-11 |
Foreign References:
| JP2005166438A | 2005-06-23 | |||
| JP2008266671A | 2008-11-06 | |||
| JP2006111670A | 2006-04-27 | |||
| JP2007123613A | 2007-05-17 | |||
| JP2007131677A | 2007-05-31 | |||
| JP2012209148A | 2012-10-25 | |||
| JP2012164484A | 2012-08-30 |
Attorney, Agent or Firm:
ABE, Hideki et al. (JP)
Hideki Abe (JP)
Hideki Abe (JP)
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